High tensile ductility in a nanostructured metal

Yinmin Wang, Mingwei Chen, Fenghua Zhou and En Ma ()
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Yinmin Wang: The Johns Hopkins University
Mingwei Chen: The Johns Hopkins University
Fenghua Zhou: The Johns Hopkins University
En Ma: The Johns Hopkins University

Nature, 2002, vol. 419, issue 6910, 912-915

Abstract: Abstract Nanocrystalline metals—with grain sizes of less than 100 nm—have strengths exceeding those of coarse-grained and even alloyed metals1,2, and are thus expected to have many applications. For example, pure nanocrystalline Cu (refs 1–7) has a yield strength in excess of 400 MPa, which is six times higher than that of coarse-grained Cu. But nanocrystalline materials often exhibit low tensile ductility at room temperature, which limits their practical utility. The elongation to failure is typically less than a few per cent; the regime of uniform deformation is even smaller1,2,3,4,5,6,7. Here we describe a thermomechanical treatment of Cu that results in a bimodal grain size distribution, with micrometre-sized grains embedded inside a matrix of nanocrystalline and ultrafine (

Date: 2002
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DOI: 10.1038/nature01133

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