Chemical reduction of three-dimensional silica micro-assemblies into microporous silicon replicas

Zhihao Bao, Michael R. Weatherspoon, Samuel Shian, Ye Cai, Phillip D. Graham, Shawn M. Allan, Gul Ahmad, Matthew B. Dickerson, Benjamin C. Church, Zhitao Kang, Harry W. Abernathy, Christopher J. Summers, Meilin Liu and Kenneth H. Sandhage ()
Additional contact information
Zhihao Bao: School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA
Michael R. Weatherspoon: School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA
Samuel Shian: School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA
Ye Cai: School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA
Phillip D. Graham: School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA
Shawn M. Allan: School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA
Gul Ahmad: School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA
Matthew B. Dickerson: School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA
Benjamin C. Church: School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA
Zhitao Kang: School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA
Harry W. Abernathy: School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA
Christopher J. Summers: School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA
Meilin Liu: School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA
Kenneth H. Sandhage: School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA

Nature, 2007, vol. 446, issue 7132, 172-175

Abstract: Silicon in good shape A low-temperature method of reducing silica (SiO2) to silicon (Si) could open up a multitude of new applications for micro-scale structures previously available only as the insulating oxide, such as diatom microshells and self-assembled structures made to order. The method converts silica to silicon at 650 °C — compared with the 2,000 °C or so needed for approaches involving molten silicon — at the same time retaining the original silica architecture. Silicon replicas, like the 14 µm-long example pictured, could find applications as sensors, and in the worlds of electronics, optics and biomedicine.

Date: 2007
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DOI: 10.1038/nature05570

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