Low-speed fracture instabilities in a brittle crystal

J. R. Kermode, T. Albaret, D. Sherman, N. Bernstein, P. Gumbsch, M. C. Payne, G. Csányi () and A. De Vita
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J. R. Kermode: Theory of Condensed Matter Group, Cavendish Laboratory, University of Cambridge, CB3 0HE, UK
T. Albaret: Université de Lyon 1, LPMCN, CNRS, UMR 5586, F69622 Villeurbanne Cedex, France
D. Sherman: Technion - Israel Institute of Technology
N. Bernstein: Center for Computational Materials Science, Naval Research Laboratory, Washington, DC 20375–5343, USA
P. Gumbsch: Institut für Zuverlässigkeit von Bauteilen und Systemen, Universität Karlsruhe (TH), Kaiserstrasse 12, 76131 Karlsruhe, Germany
M. C. Payne: Theory of Condensed Matter Group, Cavendish Laboratory, University of Cambridge, CB3 0HE, UK
G. Csányi: Engineering Laboratory, University of Cambridge, CB2 1PZ, UK
A. De Vita: King’s College London, Strand, London WC2R 2LS, UK

Nature, 2008, vol. 455, issue 7217, 1224-1227

Abstract: Silicon crack down Multiscale models predict detailed features of surfaces left by crack propagation and rationalize the occurrence of fracture instabilities in a technologically important material, silicon. As a crack propagates along the most stable cleavage plane in silicon at relatively low speeds (800 metres per second), an instability suddenly appears. The authors find that beyond the very tip of the crack, when fracture speed is slow enough, bonds are broken one atomic layer below the fracture plane leading to a systematic downward deflection of the crack. Conversely, deflecting of fracture on another cleavage plane of silicon occur when the fracture speed is very high. Preliminary simulations reveal that similar instabilities could occur in diamond and silicon carbide.

Date: 2008
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DOI: 10.1038/nature07297

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