Extreme creep resistance in a microstructurally stable nanocrystalline alloy

K. A. Darling, M. Rajagopalan, M. Komarasamy, M. A. Bhatia, B. C. Hornbuckle, R. S. Mishra and K. N. Solanki ()
Additional contact information
K. A. Darling: Army Research Laboratory, Aberdeen Proving Ground
M. Rajagopalan: School of Engineering of Matter, Transport, and Energy, Arizona State University
M. Komarasamy: University of North Texas
M. A. Bhatia: School of Engineering of Matter, Transport, and Energy, Arizona State University
B. C. Hornbuckle: Army Research Laboratory, Aberdeen Proving Ground
R. S. Mishra: University of North Texas
K. N. Solanki: School of Engineering of Matter, Transport, and Energy, Arizona State University

Nature, 2016, vol. 537, issue 7620, 378-381

Abstract: A nanocrystalline copper–tantalum alloy with high strength and extremely high-temperature creep resistance is achieved via a processing method that creates clusters of atoms within the alloy that pin grain boundaries.

Date: 2016
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DOI: 10.1038/nature19313

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