Ultralow contact resistance between semimetal and monolayer semiconductors

Pin-Chun Shen (), Cong Su, Yuxuan Lin, Ang-Sheng Chou, Chao-Ching Cheng, Ji-Hoon Park, Ming-Hui Chiu, Ang-Yu Lu, Hao-Ling Tang, Mohammad Mahdi Tavakoli, Gregory Pitner, Xiang Ji, Zhengyang Cai, Nannan Mao, Jiangtao Wang, Vincent Tung, Ju Li, Jeffrey Bokor, Alex Zettl, Chih-I Wu, Tomás Palacios, Lain-Jong Li () and Jing Kong ()
Additional contact information
Pin-Chun Shen: Massachusetts Institute of Technology (MIT)
Cong Su: University of California
Yuxuan Lin: Massachusetts Institute of Technology (MIT)
Ang-Sheng Chou: Corporate Research, Taiwan Semiconductor Manufacturing Company (TSMC)
Chao-Ching Cheng: Corporate Research, Taiwan Semiconductor Manufacturing Company (TSMC)
Ji-Hoon Park: Massachusetts Institute of Technology (MIT)
Ming-Hui Chiu: Massachusetts Institute of Technology (MIT)
Ang-Yu Lu: Massachusetts Institute of Technology (MIT)
Hao-Ling Tang: Massachusetts Institute of Technology (MIT)
Mohammad Mahdi Tavakoli: Massachusetts Institute of Technology (MIT)
Gregory Pitner: Corporate Research, Taiwan Semiconductor Manufacturing Company (TSMC)
Xiang Ji: Massachusetts Institute of Technology (MIT)
Zhengyang Cai: Massachusetts Institute of Technology (MIT)
Nannan Mao: Massachusetts Institute of Technology (MIT)
Jiangtao Wang: Massachusetts Institute of Technology (MIT)
Vincent Tung: King Abdullah University of Science & Technology (KAUST)
Ju Li: Massachusetts Institute of Technology (MIT)
Jeffrey Bokor: Lawrence Berkeley National Laboratory
Alex Zettl: University of California
Chih-I Wu: National Taiwan University
Tomás Palacios: Massachusetts Institute of Technology (MIT)
Lain-Jong Li: Corporate Research, Taiwan Semiconductor Manufacturing Company (TSMC)
Jing Kong: Massachusetts Institute of Technology (MIT)

Nature, 2021, vol. 593, issue 7858, 211-217

Abstract: Abstract Advanced beyond-silicon electronic technology requires both channel materials and also ultralow-resistance contacts to be discovered1,2. Atomically thin two-dimensional semiconductors have great potential for realizing high-performance electronic devices1,3. However, owing to metal-induced gap states (MIGS)4–7, energy barriers at the metal–semiconductor interface—which fundamentally lead to high contact resistance and poor current-delivery capability—have constrained the improvement of two-dimensional semiconductor transistors so far2,8,9. Here we report ohmic contact between semimetallic bismuth and semiconducting monolayer transition metal dichalcogenides (TMDs) where the MIGS are sufficiently suppressed and degenerate states in the TMD are spontaneously formed in contact with bismuth. Through this approach, we achieve zero Schottky barrier height, a contact resistance of 123 ohm micrometres and an on-state current density of 1,135 microamps per micrometre on monolayer MoS2; these two values are, to the best of our knowledge, the lowest and highest yet recorded, respectively. We also demonstrate that excellent ohmic contacts can be formed on various monolayer semiconductors, including MoS2, WS2 and WSe2. Our reported contact resistances are a substantial improvement for two-dimensional semiconductors, and approach the quantum limit. This technology unveils the potential of high-performance monolayer transistors that are on par with state-of-the-art three-dimensional semiconductors, enabling further device downscaling and extending Moore’s law.

Date: 2021
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DOI: 10.1038/s41586-021-03472-9

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