3D integration enables ultralow-noise isolator-free lasers in silicon photonics

Chao Xiang (), Warren Jin, Osama Terra, Bozhang Dong, Heming Wang, Lue Wu, Joel Guo, Theodore J. Morin, Eamonn Hughes, Jonathan Peters, Qing-Xin Ji, Avi Feshali, Mario Paniccia, Kerry J. Vahala and John E. Bowers ()
Additional contact information
Chao Xiang: University of California, Santa Barbara
Warren Jin: University of California, Santa Barbara
Osama Terra: University of California, Santa Barbara
Bozhang Dong: University of California, Santa Barbara
Heming Wang: University of California, Santa Barbara
Lue Wu: California Institute of Technology
Joel Guo: University of California, Santa Barbara
Theodore J. Morin: University of California, Santa Barbara
Eamonn Hughes: University of California, Santa Barbara
Jonathan Peters: University of California, Santa Barbara
Qing-Xin Ji: California Institute of Technology
Avi Feshali: Anello Photonics
Mario Paniccia: Anello Photonics
Kerry J. Vahala: California Institute of Technology
John E. Bowers: University of California, Santa Barbara

Nature, 2023, vol. 620, issue 7972, 78-85

Abstract: Abstract Photonic integrated circuits are widely used in applications such as telecommunications and data-centre interconnects1–5. However, in optical systems such as microwave synthesizers6, optical gyroscopes7 and atomic clocks8, photonic integrated circuits are still considered inferior solutions despite their advantages in size, weight, power consumption and cost. Such high-precision and highly coherent applications favour ultralow-noise laser sources to be integrated with other photonic components in a compact and robustly aligned format—that is, on a single chip—for photonic integrated circuits to replace bulk optics and fibres. There are two major issues preventing the realization of such envisioned photonic integrated circuits: the high phase noise of semiconductor lasers and the difficulty of integrating optical isolators directly on-chip. Here we challenge this convention by leveraging three-dimensional integration that results in ultralow-noise lasers with isolator-free operation for silicon photonics. Through multiple monolithic and heterogeneous processing sequences, direct on-chip integration of III–V gain medium and ultralow-loss silicon nitride waveguides with optical loss around 0.5 decibels per metre are demonstrated. Consequently, the demonstrated photonic integrated circuit enters a regime that gives rise to ultralow-noise lasers and microwave synthesizers without the need for optical isolators, owing to the ultrahigh-quality-factor cavity. Such photonic integrated circuits also offer superior scalability for complex functionalities and volume production, as well as improved stability and reliability over time. The three-dimensional integration on ultralow-loss photonic integrated circuits thus marks a critical step towards complex systems and networks on silicon.

Date: 2023
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DOI: 10.1038/s41586-023-06251-w

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