Integrated optical frequency division for microwave and mmWave generation
Shuman Sun,
Beichen Wang,
Kaikai Liu,
Mark W. Harrington,
Fatemehsadat Tabatabaei,
Ruxuan Liu,
Jiawei Wang,
Samin Hanifi,
Jesse S. Morgan,
Mandana Jahanbozorgi,
Zijiao Yang,
Steven M. Bowers,
Paul A. Morton,
Karl D. Nelson,
Andreas Beling,
Daniel J. Blumenthal () and
Xu Yi ()
Additional contact information
Shuman Sun: University of Virginia
Beichen Wang: University of Virginia
Kaikai Liu: University of California Santa Barbara
Mark W. Harrington: University of California Santa Barbara
Fatemehsadat Tabatabaei: University of Virginia
Ruxuan Liu: University of Virginia
Jiawei Wang: University of California Santa Barbara
Samin Hanifi: University of Virginia
Jesse S. Morgan: University of Virginia
Mandana Jahanbozorgi: University of Virginia
Zijiao Yang: University of Virginia
Steven M. Bowers: University of Virginia
Paul A. Morton: Palm Bay
Karl D. Nelson: Honeywell Aerospace Technologies
Andreas Beling: University of Virginia
Daniel J. Blumenthal: University of California Santa Barbara
Xu Yi: University of Virginia
Nature, 2024, vol. 627, issue 8004, 540-545
Abstract:
Abstract The generation of ultra-low-noise microwave and mmWave in miniaturized, chip-based platforms can transform communication, radar and sensing systems1–3. Optical frequency division that leverages optical references and optical frequency combs has emerged as a powerful technique to generate microwaves with superior spectral purity than any other approaches4–7. Here we demonstrate a miniaturized optical frequency division system that can potentially transfer the approach to a complementary metal-oxide-semiconductor-compatible integrated photonic platform. Phase stability is provided by a large mode volume, planar-waveguide-based optical reference coil cavity8,9 and is divided down from optical to mmWave frequency by using soliton microcombs generated in a waveguide-coupled microresonator10–12. Besides achieving record-low phase noise for integrated photonic mmWave oscillators, these devices can be heterogeneously integrated with semiconductor lasers, amplifiers and photodiodes, holding the potential of large-volume, low-cost manufacturing for fundamental and mass-market applications13.
Date: 2024
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DOI: 10.1038/s41586-024-07057-0
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