Suppressed thermal transport in silicon nanoribbons by inhomogeneous strain
Lin Yang (),
Shengying Yue,
Yi Tao,
Shuo Qiao,
Hang Li,
Zhaohe Dai,
Bai Song,
Yunfei Chen,
Jinlong Du (),
Deyu Li and
Peng Gao ()
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Lin Yang: Peking University
Shengying Yue: Xi’an Jiaotong University
Yi Tao: Southeast University
Shuo Qiao: Peking University
Hang Li: Peking University
Zhaohe Dai: Peking University
Bai Song: Peking University
Yunfei Chen: Southeast University
Jinlong Du: Peking University
Deyu Li: Vanderbilt University
Peng Gao: Peking University
Nature, 2024, vol. 629, issue 8014, 1021-1026
Abstract:
Abstract Nanoscale structures can produce extreme strain that enables unprecedented material properties, such as tailored electronic bandgap1–5, elevated superconducting temperature6,7 and enhanced electrocatalytic activity8,9. While uniform strains are known to elicit limited effects on heat flow10–15, the impact of inhomogeneous strains has remained elusive owing to the coexistence of interfaces16–20 and defects21–23. Here we address this gap by introducing inhomogeneous strain through bending individual silicon nanoribbons on a custom-fabricated microdevice and measuring its effect on thermal transport while characterizing the strain-dependent vibrational spectra with sub-nanometre resolution. Our results show that a strain gradient of 0.112% per nanometre could lead to a drastic thermal conductivity reduction of 34 ± 5%, in clear contrast to the nearly constant values measured under uniform strains10,12,14,15. We further map the local lattice vibrational spectra using electron energy-loss spectroscopy, which reveals phonon peak shifts of several millielectron-volts along the strain gradient. This unique phonon spectra broadening effect intensifies phonon scattering and substantially impedes thermal transport, as evidenced by first-principles calculations. Our work uncovers a crucial piece of the long-standing puzzle of lattice dynamics under inhomogeneous strain, which is absent under uniform strain and eludes conventional understanding.
Date: 2024
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DOI: 10.1038/s41586-024-07390-4
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