Heterogeneous integration of spin–photon interfaces with a CMOS platform

Linsen Li (), Lorenzo De Santis, Isaac B. W. Harris, Kevin C. Chen, Yihuai Gao, Ian Christen, Hyeongrak Choi, Matthew Trusheim, Yixuan Song, Carlos Errando-Herranz, Jiahui Du, Yong Hu, Genevieve Clark, Mohamed I. Ibrahim, Gerald Gilbert, Ruonan Han and Dirk Englund ()
Additional contact information
Linsen Li: Massachusetts Institute of Technology
Lorenzo De Santis: Massachusetts Institute of Technology
Isaac B. W. Harris: Massachusetts Institute of Technology
Kevin C. Chen: Massachusetts Institute of Technology
Yihuai Gao: Massachusetts Institute of Technology
Ian Christen: Massachusetts Institute of Technology
Hyeongrak Choi: Massachusetts Institute of Technology
Matthew Trusheim: Massachusetts Institute of Technology
Yixuan Song: Massachusetts Institute of Technology
Carlos Errando-Herranz: Massachusetts Institute of Technology
Jiahui Du: Massachusetts Institute of Technology
Yong Hu: Massachusetts Institute of Technology
Genevieve Clark: Massachusetts Institute of Technology
Mohamed I. Ibrahim: Cornell University
Gerald Gilbert: The MITRE Corporation
Ruonan Han: Massachusetts Institute of Technology
Dirk Englund: Massachusetts Institute of Technology

Nature, 2024, vol. 630, issue 8015, 70-76

Abstract: Abstract Colour centres in diamond have emerged as a leading solid-state platform for advancing quantum technologies, satisfying the DiVincenzo criteria1 and recently achieving quantum advantage in secret key distribution2. Blueprint studies3–5 indicate that general-purpose quantum computing using local quantum communication networks will require millions of physical qubits to encode thousands of logical qubits, presenting an open scalability challenge. Here we introduce a modular quantum system-on-chip (QSoC) architecture that integrates thousands of individually addressable tin-vacancy spin qubits in two-dimensional arrays of quantum microchiplets into an application-specific integrated circuit designed for cryogenic control. We demonstrate crucial fabrication steps and architectural subcomponents, including QSoC transfer by means of a ‘lock-and-release’ method for large-scale heterogeneous integration, high-throughput spin-qubit calibration and spectral tuning, and efficient spin state preparation and measurement. This QSoC architecture supports full connectivity for quantum memory arrays by spectral tuning across spin–photon frequency channels. Design studies building on these measurements indicate further scaling potential by means of increased qubit density, larger QSoC active regions and optical networking across QSoC modules.

Date: 2024
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DOI: 10.1038/s41586-024-07371-7

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