A RISC-V 32-bit microprocessor based on two-dimensional semiconductors

Mingrui Ao, Xiucheng Zhou, Xinjie Kong, Saifei Gou, Sifan Chen, Xiangqi Dong, Yuxuan Zhu, Qicheng Sun, Zhejia Zhang, Jinshu Zhang, Qiran Zhang, Yan Hu, Chuming Sheng, Kaixuan Wang, Shuiyuan Wang, Jing Wan, Jun Han, Wenzhong Bao () and Peng Zhou ()
Additional contact information
Mingrui Ao: Fudan University
Xiucheng Zhou: Fudan University
Xinjie Kong: Fudan University
Saifei Gou: Fudan University
Sifan Chen: Fudan University
Xiangqi Dong: Fudan University
Yuxuan Zhu: Fudan University
Qicheng Sun: Fudan University
Zhejia Zhang: Fudan University
Jinshu Zhang: Fudan University
Qiran Zhang: Fudan University
Yan Hu: Fudan University
Chuming Sheng: Fudan University
Kaixuan Wang: Fudan University
Shuiyuan Wang: Fudan University
Jing Wan: Fudan University
Jun Han: Fudan University
Wenzhong Bao: Fudan University
Peng Zhou: Fudan University

Nature, 2025, vol. 640, issue 8059, 654-661

Abstract: Abstract Recently the quest for post-silicon semiconductors has escalated owing to the inherent limitations of conventional bulk semiconductors, which are plagued by issues such as drain-induced barrier lowering, interfacial-scattering-induced mobility degradation and a constrained current on/off ratio determined by semiconductor bandwidth. These challenges have prompted the search for more advanced materials, with atomic-layer-thick two-dimensional (2D) semiconductors emerging as a potential solution. Following over a decade of research advances, recent developments1–3 in wafer-scale growth and device fabrication have led to breakthroughs in 2D semiconductor electronics. However, the level of integration remains constrained to a few hundred transistors. We describe a reduced instruction set computing architecture (RISC-V) microprocessor capable of executing standard 32-bit instructions on 5,900 MoS2 transistors and a complete standard cell library based on 2D semiconductor technology. The library contains 25 types of logic units. In alignment with advances in silicon integrated circuits, we also co-optimized the process flow and design of the 2D logic circuits. Our combined manufacturing and design methodology has overcome the significant challenges associated with wafer-scale integration of 2D circuits and enabled a pioneering prototype of an MoS2 microprocessor that exemplifies the potential of 2D integrated-circuit technology beyond silicon.

Date: 2025
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DOI: 10.1038/s41586-025-08759-9

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