An Artifact-based Simulation Method for Teaching Intellectual Property Management in an Innovation and Entrepreneurship Course
T. W. Liu,
Hongyi Sun and
Walter S. L. Fung
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T. W. Liu: Department of Advanced Design and Engineering Management, City University of Hong Kong, Hong Kong Special Administrative Region, People’s Republic of China
Hongyi Sun: Department of Advanced Design and Engineering Management, City University of Hong Kong, Hong Kong Special Administrative Region, People’s Republic of China
Walter S. L. Fung: Department of Computing, Hong Kong Polytechnic University, Hong Kong Special Administrative Region, People’s Republic of China
Asian Case Research Journal (ACRJ), 2021, vol. 25, issue 02n03, 193-212
Abstract:
Intellectual Property (IP) protection and management is the base of an entrepreneurship ecosystem. However, how to teach IP management is a relatively new topic in Asian universities. This paper reports a simulation method for teaching IP management and its impact on student learning motivation and behavior. This method uses a computer-aided software system and random-generated artefacts to simulate new product idea, execute patent trading and coordinate student teams to compete among each other while executing an IP management strategy. The project was implemented in two universities in Hong Kong in the past three years. It is found that the simulation system is quite effective in implementing action-based learning, increasing attention, and motivating students to practice more interactive learning and teamwork. It is also found that artefacts in the simulation system help competing teams to converge group thinking, induce the follow-up group actions promptly, and at the same time develop peer support and interactions for problem solving.
Keywords: Simulation; Intellectual Property management; Artifacts-based; Learning; Self-motivation (search for similar items in EconPapers)
Date: 2021
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Persistent link: https://EconPapers.repec.org/RePEc:wsi:acrjxx:v:25:y:2021:i:02n03:n:s0218927521500097
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DOI: 10.1142/S0218927521500097
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