Effect of thermal conductivity of substrate board for temperature control of electronic components: A numerical study

Anant Sidhappa Kurhade, T. Venkateswara Rao, V. K. Mathew () and Naveen G. Patil
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Anant Sidhappa Kurhade: K L Deemed to be University, Green Fields, Vaddeswaram, Guntur, Andra Pradesh, 522502, India
T. Venkateswara Rao: Mechanical Department, DBS Institute of Technology, Kavali, SPSR Nellore, Nellore, Andhra Pradesh 524201, India
V. K. Mathew: MIT School of Engineering, MIT ADT University, Pune 412201, India
Naveen G. Patil: School of Engineering, Ajeenkya D Y Patil Innovation University, Pune 412105, India

International Journal of Modern Physics C (IJMPC), 2021, vol. 32, issue 10, 1-12

Abstract: The current study deals with the numerical investigation of the substrate board characteristics using different materials (FR4, silicon cladding and copper cladding) on which nine nonidentical electronic components (ECs) are mounted, which are supplied with nonuniform heat flux. The study is conducted for natural and forced convection (3m/s and 5m/s) modes of heat transfer. It is observed that for 5m/s the temperature of the ECs is dropped by 30–47∘C using copper cladding board in comparison to FR4 and silicon cladding board. It is also noted that with the use of copper cladding board the velocity of air required for cooling the ECs is substantially reduced by 2m/s and the temperature of the IC chip is reduced by 1.50–11.12∘C.

Keywords: Copper cladding; electronic cooling; forced convection; thermal conductivity (search for similar items in EconPapers)
Date: 2021
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DOI: 10.1142/S0129183121501321

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