Thermal control of IC chips using phase change material: A CFD investigation

Anant Sidhappa Kurhade and G. Murali
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Anant Sidhappa Kurhade: Department of Mechanical Engineering, Koneru Lakshmaiah Education Foundation, Green Fields, Vaddeswaram, Guntur (Dt), Andhra Pradesh 522502, India2Department of Mechanical Engineering, Pimpri Chinchwad College of Engineering & Research, Ravet, Pune, Maharashtra 412101, India
G. Murali: Department of Mechanical Engineering, Koneru Lakshmaiah Education Foundation, Green Fields, Vaddeswaram, Guntur (Dt), Andhra Pradesh 522502, India

International Journal of Modern Physics C (IJMPC), 2022, vol. 33, issue 12, 1-18

Abstract: The aim of this paper is to provide an implicit transient numerical formulation of novel minichannel-coupled passive thermal arrangement to cool down unidentical IC chips on substrate board. In the proposed design, PCM is integrated in the minichannel which is kept at the periphery of IC chips. Through means of direct conduction from substrate board, phase change material absorbs latent heat and allows it to change its phase from solid to liquid by providing effective thermal cooling performance in system. A comparative study is developed between without PCM, with minichannel-coupled PCM and optimized single minichannel near the heat source. Results show that between paraffin wax, N-Eicosane and ATP 78 PCM, N-Eicosane can provide effective cooling performance. With the N-Eicosane temperature in the system controlled from 53.234∘C of the generic model to 51.520∘C and a significant 1.74∘C of temperature drop compared with the generic model, an additional 0.5∘C of temperature reduction occurs as compared with the case of paraffin wax PCM and 1.35∘C when compared with ATP 78 PCM.

Keywords: CFD; IC chips; phase change material; thermal control (search for similar items in EconPapers)
Date: 2022
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DOI: 10.1142/S0129183122501595

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