Fatigue Life Model for PLCC Solder Joints Under Thermal Cycling Stress

Rohit Khatri, Diana Denice and Manoj Kumar ()
Additional contact information
Rohit Khatri: Homi Bhabha National Institute
Diana Denice: Bhabha Atomic Research Centre
Manoj Kumar: Bhabha Atomic Research Centre

A chapter in Advances in RAMS Engineering, 2020, pp 85-107 from Springer

Abstract: Abstract Solder joints are inevitable part of assembly of an electronic system. These joints are mainly for establishing electrical connection between components, in addition these are also responsible for mechanical bonding and act as heat paths. Life cycle stresses affect the integrity of these contacts and lead to jeopardizing of its functions and in turn to failure of system. The reducing size and changing geometry of solder joints coupled with high power density of the components has increased the contribution of solder joint failure in total system failure. Cycle stresses lead to fatigue failure of solder joints. Thermal cycling is reported to be the major cause of failures. Life estimation of solder joints is important to predict the time to failure and take counter measures. The chapter addresses this issue by specializing an established empirical model for fatigue failure, Coffin-Manson, for a PLCC solder joint using experimental data.

Keywords: Solder joints; Thermal cycle; Fatigue life; Coffin-Manson; Finite element method (search for similar items in EconPapers)
Date: 2020
References: Add references at CitEc
Citations:

There are no downloads for this item, see the EconPapers FAQ for hints about obtaining it.

Related works:
This item may be available elsewhere in EconPapers: Search for items with the same title.

Export reference: BibTeX RIS (EndNote, ProCite, RefMan) HTML/Text

Persistent link: https://EconPapers.repec.org/RePEc:spr:ssrchp:978-3-030-36518-9_4

Ordering information: This item can be ordered from
http://www.springer.com/9783030365189

DOI: 10.1007/978-3-030-36518-9_4

Access Statistics for this chapter

More chapters in Springer Series in Reliability Engineering from Springer
Bibliographic data for series maintained by Sonal Shukla () and Springer Nature Abstracting and Indexing ().