From Phenomena to Mechanisms: A Time–Space–Matter Multidimensional Analysis of Aerospace Electronic Failures

Zongsheng Xie, Dawei Zhu, Mengjiang Liu and Danye Li
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Zongsheng Xie: China Astronautics Standards Institute
Dawei Zhu: Beijing Satellite Navigation Center
Mengjiang Liu: China Electronics Technology Group Corporation
Danye Li: China Academy of Electronics and Information Technology

A chapter in Data-Driven Methods for Reliability and Safety Engineering: Applications in Industrial Systems, 2026, pp 403-416 from Springer

Abstract: Abstract Aerospace electronic products require exceptionally high reliability due to their mission-critical roles and operation within extreme environments. Despite rigorous quality controls, hardware and software failures remain inevitable. The Chinese aerospace industry adopts a distinctive Quality Problem Closed loop methodology; however, fault phenomena are often oversimplified in engineering practice. Such simplification risks the omission of essential contextual information, thereby diminishing the accuracy and efficiency of fault diagnosis and root cause analysis. To address this challenge, the present study systematically categorizes failure phenomena in aerospace electronics and proposes a three-dimensional analytical framework encompassing time, space, and matter. By integrating multi-source data fusion with an innovative Four Diagnosis approach comprising inspection, ausculation&olfaction, inquiry, and palpation, this research establishes a structured methodology for fault characterization. This approach enhances the traceability and comprehensiveness of fault data inputs within Quality Problem Closed loop processes throughout spacecraft development, system integration testing, and in-orbit operations. Ultimately, it contributes to improving the efficiency of closed-loop quality management in aerospace engineering.

Keywords: Aerospace; Electronic products; Fault phenomena; Quality problem closed-loop (search for similar items in EconPapers)
Date: 2026
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Persistent link: https://EconPapers.repec.org/RePEc:spr:ssrchp:978-3-032-22873-4_29

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DOI: 10.1007/978-3-032-22873-4_29

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