Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections

Cher Ming Tan (), Wei Li (), Zhenghao Gan () and Yuejin Hou ()
Additional contact information
Cher Ming Tan: Nanyang Technological University
Wei Li: Singapore Institute of Manufacturing
Zhenghao Gan: Semiconductor Manufacturing
Yuejin Hou: #10-226 BLK156

in Springer Series in Reliability Engineering from Springer, currently edited by Hoang Pham

Date: 2011
Edition: 1
ISBN: 978-0-85729-310-7
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Chapters in this book:

Ch Chapter 1 Introduction

Cher Ming Tan, Zhenghao Gan, Wei Li and Yuejin Hou

Ch Chapter 2 Development of Physics-Based Modeling for ULSI Interconnections Failure Mechanisms: Electromigration and Stress-Induced Voiding

Cher Ming Tan, Zhenghao Gan, Wei Li and Yuejin Hou

Ch Chapter 3 Introduction and General Theory of Finite Element Method

Cher Ming Tan, Zhenghao Gan, Wei Li and Yuejin Hou

Ch Chapter 4 Finite Element Method for Electromigration Study

Cher Ming Tan, Zhenghao Gan, Wei Li and Yuejin Hou

Ch Chapter 5 Finite Element Method for Stress-Induced Voiding

Cher Ming Tan, Zhenghao Gan, Wei Li and Yuejin Hou

Ch Chapter 6 Finite Element Method for Dielectric Reliability

Cher Ming Tan, Zhenghao Gan, Wei Li and Yuejin Hou

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DOI: 10.1007/978-0-85729-310-7

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