Hierarchical Factor Analysis Methodology for Intelligent Manufacturing
Hyun Sik Sim and
Huihua Chen
Complexity, 2021, vol. 2021, 1-13
Abstract:
To realize intelligent manufacturing, a controllable factory must be built, and manufacturing competitiveness must be achieved through the improvement of product quality and yield. The yield in the micromanufacturing process is gaining importance as a management factor used in deciding the production cost and product quality as product functions becomes more sophisticated. Because the micromanufacturing process involves manufacturing products through multiple steps, it is difficult to determine the process or equipment that has encountered failure, which can lead to difficulty in securing high yields. This study presents a structural model for building a factory integration system to analyze big data at manufacturing sites and a hierarchical factor analysis methodology to increase product yield and quality in an intelligent manufacturing environment. To improve the product yield, it is necessary to analyze the fault factors that cause low yields and locate and manage the critical processes and equipment factors that affect these fault factors. However, yield management is a difficult problem because there exists a correlation between equipment, and in the sequence of process equipment that the lot passed through, the downstream and the upstream cause complex faults. This study used data-mining techniques to identify suspected processes and equipment that affect the yield of products in the manufacturing process and to analyze the key factors of the equipment. Ultimately, we propose a methodology to find the key factors of the suspected process and equipment that directly affect the implementation of the intelligent manufacturing scheme and the yield of the product. To verify the effect of key parameters of critical processes and equipment on the yield, the proposed methodology was applied to actual manufacturing sites.
Date: 2021
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Persistent link: https://EconPapers.repec.org/RePEc:hin:complx:5593374
DOI: 10.1155/2021/5593374
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