Specific Packaging Reliability Testing

Gan Chong Leong () and Huang Chen-Yu ()
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Gan Chong Leong: Micron Memory Taiwan Co. Ltd.
Huang Chen-Yu: Micron Memory Taiwan Co. Ltd.

Chapter Chapter 6 in Interconnect Reliability in Advanced Memory Device Packaging, 2023, pp 119-151 from Springer

Abstract: Abstract In the past 5 years, advanced Silicon node and packaging technology are significantly driven by the growing market on 5G applications, high performance computing (HPC), internet of thing (IoT) and electronics in autonomous vehicle.

Date: 2023
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Persistent link: https://EconPapers.repec.org/RePEc:spr:ssrchp:978-3-031-26708-6_6

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DOI: 10.1007/978-3-031-26708-6_6

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