Interconnect Reliability in Advanced Memory Device Packaging

Gan Chong Leong () and Huang Chen-Yu ()
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Gan Chong Leong: Micron Memory Taiwan Co. Ltd.
Huang Chen-Yu: Micron Memory Taiwan Co. Ltd

in Springer Series in Reliability Engineering from Springer, currently edited by Hoang Pham

Date: 2023
ISBN: 978-3-031-26708-6
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Chapters in this book:

Ch Chapter 1 Advanced Memory and Device Packaging

Gan Chong Leong and Huang Chen-Yu

Ch Chapter 2 Wearout Reliability-Based Characterization in Memory Packaging

Gan Chong Leong and Huang Chen-Yu

Ch Chapter 3 Recycling of Noble Metals Used in Memory Packaging

Gan Chong Leong and Huang Chen-Yu

Ch Chapter 4 Advanced Flip Chip Packaging

Gan Chong Leong and Huang Chen-Yu

Ch Chapter 5 Second Level Interconnect Reliability of Low Temperature Solder Materials Used in Memory Modules and Solid-State Drives (SSD)

Gan Chong Leong and Huang Chen-Yu

Ch Chapter 6 Specific Packaging Reliability Testing

Gan Chong Leong and Huang Chen-Yu

Ch Chapter 7 Reliability Simulation and Modeling in Memory Packaging

Gan Chong Leong and Huang Chen-Yu

Ch Chapter 8 Interconnects Reliability for Future Cryogenic Memory Applications

Gan Chong Leong and Huang Chen-Yu

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Persistent link: https://EconPapers.repec.org/RePEc:spr:ssreng:978-3-031-26708-6

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DOI: 10.1007/978-3-031-26708-6

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