Reliability Simulation and Modeling in Memory Packaging

Gan Chong Leong () and Huang Chen-Yu ()
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Gan Chong Leong: Micron Memory Taiwan Co. Ltd.
Huang Chen-Yu: Micron Memory Taiwan Co. Ltd.

Chapter Chapter 7 in Interconnect Reliability in Advanced Memory Device Packaging, 2023, pp 153-184 from Springer

Abstract: Abstract In the advanced packaging technology development, numerical simulation is one of the indispensable steps that could provide the key index of the failure mechanism, package’s physical behavior in process or under reliability stresses, and further determine the high-risk factors in product design stage.

Date: 2023
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Persistent link: https://EconPapers.repec.org/RePEc:spr:ssrchp:978-3-031-26708-6_7

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DOI: 10.1007/978-3-031-26708-6_7

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