Influences of Electronic Materials Properties on Packaging Reliability

Chong Leong Gan () and Chen Yu Huang ()
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Chong Leong Gan: Micron Memory Taiwan Co., Ltd.
Chen Yu Huang: Micron Memory Taiwan Co., Ltd.

Chapter Chapter 1 in Electronic Materials Innovations and Reliability in Advanced Memory Packaging, 2025, pp 1-24 from Springer

Abstract: Abstract Semiconductor packaging materials have very strong influences in final package quality and reliability. There are many previous studies being carried out in characterizing effects of key materials properties of epoxy molding compound (EMCEpoxy Molding Compound (EMC)), solder alloys, die attach film (DAFDie Attach Film (DAF)), bonding wires, capillary underfillCapillary Underfill (CUF) materials and solder pastes [1]. In this chapter, the influencing factors of such as prevailing interconnect materials (bonding wires, solder alloys, solder paste), polymeric materials (epoxy molding compoundEpoxy Molding Compound (EMC), die attach filmDie Attach Film (DAF) and underfillUnderfill (UF) materials), advanced specialty low temperature soldersLow Temperature Solder (LTS), technical challenges with stacked die packaging and characterization of electronic packaging materials will be discussed.

Date: 2025
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Persistent link: https://EconPapers.repec.org/RePEc:spr:ssrchp:978-3-031-94795-7_1

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DOI: 10.1007/978-3-031-94795-7_1

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