Electronic Materials Innovations and Reliability in Advanced Memory Packaging

Chong Leong Gan () and Chen Yu Huang ()
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Chong Leong Gan: Micron Memory Taiwan Co. Ltd.
Chen Yu Huang: Micron Memory Taiwan, Co., Ltd.

in Springer Series in Reliability Engineering from Springer, currently edited by Hoang Pham

Date: 2025
ISBN: 978-3-031-94795-7
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Chapters in this book:

Ch Chapter 1 Influences of Electronic Materials Properties on Packaging Reliability

Chong Leong Gan and Chen Yu Huang

Ch Chapter 2 Epoxy Molding Compounds in Mechanical and Thermal Stress in Packaging Reliability

Chong Leong Gan and Chen Yu Huang

Ch Chapter 3 Materials Development for Future Datacenter Applications

Chong Leong Gan and Chen Yu Huang

Ch Chapter 4 Substrate and Printed Circuits Board (PCB) for Memory Device Packaging

Chong Leong Gan and Chen Yu Huang

Ch Chapter 5 Materials for Thermal Management in Advanced Memory Packaging

Chong Leong Gan and Chen Yu Huang

Ch Chapter 6 Hardware Reliability for Module and Solid-State Drives (SSDs)

Chong Leong Gan and Chen Yu Huang

Ch Chapter 7 Evolutions of Solder Materials for Memory Packaging in Handheld, Automotive and Cryogenic Applications

Chong Leong Gan and Chen Yu Huang

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DOI: 10.1007/978-3-031-94795-7

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