Evolutions of Solder Materials for Memory Packaging in Handheld, Automotive and Cryogenic Applications

Chong Leong Gan () and Chen Yu Huang ()
Additional contact information
Chong Leong Gan: Micron Memory Taiwan Co., Ltd.
Chen Yu Huang: Micron Memory Taiwan Co., Ltd.

Chapter Chapter 7 in Electronic Materials Innovations and Reliability in Advanced Memory Packaging, 2025, pp 151-173 from Springer

Abstract: Abstract The purpose of this Chapter is to provide an overview of evolutions of solder materials used in semiconductor assembly and packaging. Also, with the aim to study the key technical barriers, challenges of deployment and its reliability performance of different solder alloy interconnect reliability requirements in semiconductor device packaging by different market segments especially in mobile handheld as well as automotive requirements. This chapter lays out the history and important evolutions of different solder alloys in semiconductor packaging followed by ways to fulfil needs of different market segments.

Date: 2025
References: Add references at CitEc
Citations:

There are no downloads for this item, see the EconPapers FAQ for hints about obtaining it.

Related works:
This item may be available elsewhere in EconPapers: Search for items with the same title.

Export reference: BibTeX RIS (EndNote, ProCite, RefMan) HTML/Text

Persistent link: https://EconPapers.repec.org/RePEc:spr:ssrchp:978-3-031-94795-7_7

Ordering information: This item can be ordered from
http://www.springer.com/9783031947957

DOI: 10.1007/978-3-031-94795-7_7

Access Statistics for this chapter

More chapters in Springer Series in Reliability Engineering from Springer
Bibliographic data for series maintained by Sonal Shukla () and Springer Nature Abstracting and Indexing ().