Materials Development for Future Datacenter Applications

Chong Leong Gan () and Chen Yu Huang ()
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Chong Leong Gan: Micron Memory Taiwan Co., Ltd.
Chen Yu Huang: Micron Memory Taiwan Co., Ltd.

Chapter Chapter 3 in Electronic Materials Innovations and Reliability in Advanced Memory Packaging, 2025, pp 45-80 from Springer

Abstract: Abstract What has been the most prominent and trending topic across global tech industries since 2022? The most fitting answer is likely ‘Generative Artificial IntelligenceGenerative Artificial Intelligence (GenAI)’ (GenAIGenerative Artificial Intelligence (GenAI)), which refers to artificial intelligence (AIArtificial Intelligence (AI)) systems created to produce new data or information that resembles human output. The rise of AIArtificial Intelligence (AI) has significantly impacted networks and computing data centers, driving the need for technical innovations to support future infrastructure improvements. Nearly all industry leaders and tech giants are actively seeking technology relevant to (1) high-speed, high-bandwidth data communications; (2) sustainable and reliable energy and cooling solutions, and (3) novel materials, to enhance various aspects of their businesses and boost their high-performance computing (HPCHigh Performance Computing (HPC)) capabilities, aiming towards the development of AIArtificial Intelligence (AI)-driven data centers.

Date: 2025
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DOI: 10.1007/978-3-031-94795-7_3

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