Substrate and Printed Circuits Board (PCB) for Memory Device Packaging

Chong Leong Gan () and Chen Yu Huang ()
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Chong Leong Gan: Micron Memory Taiwan Co., Ltd.
Chen Yu Huang: Micron Memory Taiwan Co., Ltd.

Chapter Chapter 4 in Electronic Materials Innovations and Reliability in Advanced Memory Packaging, 2025, pp 81-100 from Springer

Abstract: Abstract Semiconductor packaging substrate and printed circuits board (PCBPrinted Circuit Boards (PCB)) materials have very strong influences in final package quality and reliability. There are many previous studies being carried out in characterizing effects of substrate and PCBPrinted Circuit Boards (PCB) material properties and materials used in memory modules and solid state drive (SSDSolid State Drive (SSD)) for board level reliability [1–6]. This chapter will review the influencing factors and technical challenges of prevailing substrates and PCBsPrinted Circuit Boards (PCB), focusing on hardware engineering and system-level packaging characterization.

Date: 2025
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Persistent link: https://EconPapers.repec.org/RePEc:spr:ssrchp:978-3-031-94795-7_4

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DOI: 10.1007/978-3-031-94795-7_4

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