Introduction and General Theory of Finite Element Method

Cher Ming Tan (), Zhenghao Gan (), Wei Li () and Yuejin Hou ()
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Cher Ming Tan: Nanyang Technological University
Zhenghao Gan: Semiconductor Manufacturing International (Shanghai) Corp.
Wei Li: Singapore Institute of Manufacturing Technology
Yuejin Hou: Nanyang Technological University

Chapter Chapter 3 in Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections, 2011, pp 39-71 from Springer

Abstract: Abstract The complexity of the physics of electromigration and the stress-induced voiding can be seen in Chap. 2 . In order to model the physics realistically in today’s interconnects so as to obtain better understanding of the physics and to identify key parameters, FEM is needed as pointed out in Chap. 2 . To begin the discussion on FEM applications in electromigration and stress-induced voiding, let us have a basic understanding on the FEM. For readers familiar with FEM, this chapter may be skipped.

Keywords: Finite Element Method; Stress Analysis; Joule Heating; Finite Element Formulation; Partial Differential Equation (search for similar items in EconPapers)
Date: 2011
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DOI: 10.1007/978-0-85729-310-7_3

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