Second Level Interconnect Reliability of Low Temperature Solder Materials Used in Memory Modules and Solid-State Drives (SSD)

Gan Chong Leong () and Huang Chen-Yu ()
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Gan Chong Leong: Micron Memory Taiwan Co. Ltd.
Huang Chen-Yu: Micron Memory Taiwan Co. Ltd.

Chapter Chapter 5 in Interconnect Reliability in Advanced Memory Device Packaging, 2023, pp 95-117 from Springer

Abstract: Abstract The purpose of this chapter is to provide an overview of current and future deployment of second level interconnect reliability on types of second level solder alloys used in semiconductor assembly and packaging.

Date: 2023
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Persistent link: https://EconPapers.repec.org/RePEc:spr:ssrchp:978-3-031-26708-6_5

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DOI: 10.1007/978-3-031-26708-6_5

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