Interconnects Reliability for Future Cryogenic Memory Applications

Gan Chong Leong () and Huang Chen-Yu ()
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Gan Chong Leong: Micron Memory Taiwan Co. Ltd.
Huang Chen-Yu: Micron Memory Taiwan Co. Ltd.

Chapter Chapter 8 in Interconnect Reliability in Advanced Memory Device Packaging, 2023, pp 185-207 from Springer

Abstract: Abstract The utility of the world internet is on the rise as it is recorded that 46% of the world’s population have become internet users who generates data traffic of up to 8 zettabytes daily. This increase has triggered the growth of data center infrastructure as processing, storage, and communication system in the digital world.

Date: 2023
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Persistent link: https://EconPapers.repec.org/RePEc:spr:ssrchp:978-3-031-26708-6_8

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DOI: 10.1007/978-3-031-26708-6_8

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