Materials for Thermal Management in Advanced Memory Packaging

Chong Leong Gan () and Chen Yu Huang ()
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Chong Leong Gan: Micron Memory Taiwan Co., Ltd.
Chen Yu Huang: Micron Memory Taiwan Co., Ltd.

Chapter Chapter 5 in Electronic Materials Innovations and Reliability in Advanced Memory Packaging, 2025, pp 101-128 from Springer

Abstract: Abstract The importance of thermal management for electronics has been mentioned for decades. The major cause of electronic failures relevant to temperature are about 55% reported at that time [1], and others caused by vibration and humidity each contribute to around 20% of failures.

Date: 2025
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Persistent link: https://EconPapers.repec.org/RePEc:spr:ssrchp:978-3-031-94795-7_5

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DOI: 10.1007/978-3-031-94795-7_5

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