Hardware Reliability for Module and Solid-State Drives (SSDs)

Chong Leong Gan () and Chen Yu Huang ()
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Chong Leong Gan: Micron Memory Taiwan Co., Ltd.
Chen Yu Huang: Micron Memory Taiwan Co., Ltd.

Chapter Chapter 6 in Electronic Materials Innovations and Reliability in Advanced Memory Packaging, 2025, pp 129-149 from Springer

Abstract: Abstract Semiconductor packaging materials have very strong influences in final package quality and reliability. There are many previous studies being carried out in characterizing effects of key direct materials used in memory modules and solid-state drive (SSDSolid State Drive (SSD)) for board level reliability [1–6]. In this chapter, the influencing factors of such as prevailing hardware and components (actives, passives, connectors, enclosure, heatsink), polymeric materials (edge bond, corner fill, underfillUnderfill (UF) materials), thermal interface materialsThermal Interface Material (TIM) (TIMThermal Interface Material (TIM)), technical challenges with hardware engineering and characterization of system level packaging will be discussed.

Date: 2025
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DOI: 10.1007/978-3-031-94795-7_6

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